Spot Bonding Machine YCD-3

The spot bonding machine YCD-3 is used for preparation process before lamination to ensure lamination quality. This machine adopts electric heating, and the spot bonding pressure and time are adjustable, and the bonding spot is smooth. The spot bonding head is movable in the full range of guide. The lamp is installed under the working table for checking whether the inner coil location inside RFID card PVC layer is correct or not before.

Technical parameters:
Applicable material: PVC or other plastic material
Size of material (max.): 400×500
Thickness of material: 0.3-1.0 mm
Pressure: 0.6MPa
Heating temperature: <200ºC
Temp. control: ±2.0ºC
Number of bonding head: 3 groups
Productivity: 200 sheets /hr.
Power supply: AC220V 50/60Hz single phase 3-wire
Power: 600W
Weight: approx.40kg
Dimension: L1000×W550×H1000mm