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round wire 2.5*500 | ¥0.0 | 272 kg available |
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flat fiber 1.3*3.2*500 | ¥0.0 | 293 kg available |
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Gu de (Zhejiang Jinhua) Refrigeration Co. , Ltd. 1yr.
Main Products:Refrigeration unit equipment
Contacts:Wei QingChat
Mobile:86-13411577751
Address:Shetang Office Room 605, Building 1, Erich Paulun Ming Yuan, 1500 Huafeng West Road, Jindong District Economic Development Zone,Jindong,Jinhua City,Zhejiang Province
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Name: Phosphor Copper Welding Rod
Specification: Φ2.5*500mm
The application of phosphor bronze welding rodsSuitable for the welding of copper and copper pipe joints in the refrigeration systems of air conditioners, refrigerators, and freezers.
1、 BCu92P:Composition P: 7.5-8.5%, Copper: Bal. Melting temperature: 710-750°C. Low melting point, good fluidity, but relatively brittle. Generally used for brazing without impact loads and vibration-free copper and brass parts.
2、BCu93P(HL201/BCuP-2):成分 P:6.80-7.50%,铜:余量。熔化温度,该焊料流动性好,可以流入间隙很小的接头,但钎料脆,一般用于机电和仪表工业,钎焊不受冲击载荷的铜和黄铜零件;
3、BCu89SnP(HL208):Composition: P: 6.80-7.50%, Tin: 5.0-6.0%, Copper: Balance. Melting temperature: 620-660°C. This solder has a low melting point and good fluidity, which can be brazed with silver flux for copper, brass, bronze, and low-zinc brass parts.
4、BCu86SnP:Composition P: 4.80-5.80%, Tin: 7.00-8.00%, Nickel: 0.40-1.20%, Copper: Bal. Melting temperature: 620-670°C. The solder has the same application as above. The addition of nickel increases the brittleness, but improves the fluidity and results in a bright weld. It is generally used for brazing of copper and brass.
5、BCu91AgP(HL209/BCuP-6):成分 P:5.50-7.50%,银1.80-2.20%,铜:余量。熔化温度645-771℃,熔点低,该焊料能在较大温度范围内填充接头间隙,多用于电冰箱、空调器、电机和仪表行等业钎焊铜及黄铜件;
6、BCu89AgP(BCuP-3):成分 P:5.8-6.70%,银4.80-5.20%,铜:余量。熔化温度645-788℃,熔点低,该焊料延性和导电性得到提高,流动性一般,适宜于钎焊间隙较大的铜及黄铜零件;
7、BCu88AgP(HL205/BCuP-7):成分 P:6.50-7.00%,银4.80-5.20%,铜:余量。熔化温度645-780℃,熔点低,该焊料延性和导电性得到提高,流动性好于B-Cu89PAg,一般用于钎焊间隙较大的铜及黄铜零件;
8、BCu87PAg(BCuP-4):成分 P:7.0-7.5%,银5.80-6.20%,铜:余量。熔化温度645-718℃,熔点低,该焊料熔点低,流动性很好,能钎焊间隙较小的接头,一般用于铜及黄铜部件的钎焊;
9、BCu80PAg(HL204/BCuP-5):成分 P:4.80-5.30%,银14.50-15.50%,铜:余量。熔化温度645-815℃,熔点低,该焊料的延性和导电性得到进一步的改善,用于焊接要求比HL205(5%银)钎料高且接头间隙较大的铜及黄铜零件。
10、BCu60ZnSn-R (S221/RBCuZn-A): Composition: Copper: 59.00-61.00%, Tin: 0.80-1.20%, Silicon: 0.15-0.35%, Zinc: Balanced. Melting temperature: 890-905°C. This solder has a relatively high melting point and can be used for welding hard alloy tools, molds, and mining tools. It can also replace H62 solder to obtain a more dense weld seam, and can be used as a welding wire for gas welding brass.
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