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manufacturers supply graphene nano carbon copper foil uniform heat sheet copper-based conductive heat dissipation mobile phone computer with glue heat-conducting fin

  • EXW Price:
    CN¥ 11.5 ~ CN¥ 1,150.0
    Min. order: 1 piece
  • 1 piece
  • Weight 0.337 kg/piece
  • model
  • Specifications
    200mm * 100mm * 0.1mm CN¥ 11.5
    200mm * 10 m * 0.1mm CN¥ 644.0
    200mm * 100mm * 0.15mm CN¥ 12.65
    200mm * 10 m * 0.15mm CN¥ 667.0
    200mm * 100mm * 0.3mm CN¥ 20.7
    200mm * 10 m * 0.3mm CN¥ 1150.0
    200mm * 100mm * 0.5mm CN¥ 34.5
    200mm * 250mm * 0.5mm CN¥ 57.5
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lufamaoyi 2yr.

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  • Description
brand: nano carbon copper graphene
brand: nano carbon copper graphene
material surface treatment: oxidized black
material surface treatment: oxidized black
application scope: mobile phone chip electronic products
application scope: mobile phone chip electronic products

Nanocarbon copper foil has high thermal conductivity and heat dissipation properties.

Able to protect sensitive electronic components from damage caused by excessive temperature.

With release paper and high-temperature backing adhesive, it can be pasted anywhere as needed.

Has good electromagnetic shielding performance

Product Description: The uniform heat conduction and heat dissipation material is based on nano-processed copper foil, with one side coated with a low-acid uniform heat radiation adhesive layer and the other side coated with a nano-thermal conductivity material coating. This new technology is commonly used in thickness specifications of 0.1mm, and its uniform heat performance is superior to that of artificial graphite sheets. The product can achieve a complete machine cooling of 6~15℃.

Product Advantages:

1. By conducting heat dissipation + convective heat dissipation + radiation heat dissipation, it can quickly convert point heat sources into surface heat sources.

2. It can reduce the temperature of electronic products, protect electronic components, and extend the life of electronic products.
3. Develop low-acid heat-radiation uniform adhesive, which does not corrode electronic components.

4. The material possesses excellent insulation properties.

5. After die-cutting, the edges are neat with no dust. After die-cutting of graphite film or artificial graphite film, there is graphite dust left on the edges, which may affect the internal electronic components of products such as mobile phones, tablets, etc.

6. Using nano-scale copper as the substrate facilitates precise slicing without breaking, resulting in a higher yield. Graphite and artificial graphite do not have a copper base layer, which makes them prone to damage during slicing and pasting processes.

7. It is beneficial for machine repair and can be reused. However, when graphite film or artificial graphite film is repaired, if it is damaged, it cannot be reused, which is not conducive to repair.

8. After die-cutting, the product can be used directly. Some products do not need edge binding (e.g., if they directly contact with electronic components and circuits, it is recommended to edge bind to prevent any abnormalities), which saves time and cost. However, graphite and artificial graphite require edge binding and insulation treatment, which increases time and cost.

Heat dissipation features:

 1. Heat radiation cooling is the main method.

 2. Any object, as long as its temperature is higher than 0K, will continuously emit thermal radiation into the surrounding space;

 4. With the transformation of energy forms;

 5. Has a strong directionality.

 6. Radiant energy is related to both temperature and wavelength.

 7. The emission of radiation depends on the fourth power of temperature.

Product Parameters:

Thickness range: 0.1mm~0.5mm

2、Adhesive layer temperature resistance: 130℃

3. Substrate temperature resistance: over 1000 degrees Celsius

4、Coating Thickness: 20um~40um

5. Thermal Conductivity: Vertical 20W/mK, Lateral 600W/mK

6. Radiation wavelength of heat dissipation: 0.85um

7. Peel strength: 150 MPa

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Update time:20260501083947


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