tec1-12706 12704 12705 12708 12709 12710 12712 12715 cooling piece

The cooling chip operates by cooling while generating heat. During operation, it is essential to ensure proper heat dissipation from the heating surface. It is strictly prohibited to power on the device for more than 2 seconds without adequate cooling, as this may lead to overheating and damage—the buyer is responsible for any resulting issues!

It is necessary to apply thermal paste when installing the radiator.

There is a term "cold face," but no term "hot face."

For foreign trade customers, the power does not meet the original specifications.

Those with high requirements, please order the original products from other stores. The quality should not be compared to the original ones; you get what you pay for. Avoid purchasing high-power models!

For bulk customers, please first purchase a sample to test it out.

No returns accepted

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Model Number: TEC1-1.2703
Physical dimensions: 40*40*4.0mm ±0.1, 127 pairs of components

Wire specifications: Lead length 310mm ± 5mm; RV standard wire, single end 5mm tinned.
Internal resistance: 4.0~4.3Ω (ambient temperature 23±1℃, 1kHZ AC test)
Large temperature difference: △Tmax(Qc=0) above 60℃.
Working current: Imax = 12 (when powered on at rated voltage)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling Power: Qcmax 27W
Assembly pressure: 85N/cm2
Work environment: Temperature range -55℃ to 83℃ (excessive ambient temperature directly affects cooling efficiency)
Encapsulation process: Standard 704 silicone rubber sealing around the perimeter
Packaging standards: foam box packaging, storage conditions: ambient temperature -10℃ to 40℃
Storage conditions: -4°C to 60°C

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Chip model: TEC1-1.2704
Physical dimensions: 40*40*4.2 mm Number of components: 127
Wire specifications: Lead length 100±5mm, RV standard wire, single end 5mm tinned.
Internal resistance: 3.0~3.3Ω (ambient temperature 23±1℃, 1kHZ AC test)
Large temperature difference: △Tmax(Qc=0) above 60℃.
Working current: Imax=12 (when powered at rated voltage)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling Power: Qcmax 36W
Assembly pressure: 85N/cm2
Work environment: Temperature range of -55℃ to 83℃ (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: Standard 704 silicone rubber sealing around the perimeter
Packaging standards: Foam box packaging, storage conditions: ambient temperature -10℃ to 40℃
Storage conditions: -4°C to 60°C

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Chip model: TEC1-1.2705
Physical dimensions: 40*40*3.8 mm Number of components: 127
Wire specifications: Lead length 100±5mm, RV standard wire, single end 5mm tinned.
Internal resistance: 2.4~2.7Ω (ambient temperature 23±1℃, 1kHZ AC test)
Large temperature difference: △Tmax(Qc=0) above 61℃.
Working current: Imax = 5 (when powered on at rated voltage)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling Power: Qcmax 45W
Assembly pressure: 85N/cm2
Work environment: Temperature range of -55℃ to 83℃ (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: Standard 704 silicone rubber sealing around the perimeter
Packaging standards: Foam box packaging, storage conditions: ambient temperature -10℃ to 40℃
Storage conditions: -4°C to 60°C

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Chip model: TEC1-1.2706

External dimensions: 40*40*3.75 mm

Internal resistance: 2.1~2.4Ω (ambient temperature 23±1℃, 1kHZ AC test)
Large temperature difference: △Tmax(Qc=0) above 59℃.
Working current: Imax = 4.3–4.6 A (at 12 V rating)
Rated voltage: 12V (Vmax: 15V; starting current: 5.8A)
Cooling Power: Qcmax 60-72W
Work environment: Temperature range of -55℃ to 83℃ (excessive ambient temperature directly affects cooling efficiency)

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Chip model: TEC1-1.2708
Physical dimensions: 40*40*3.5 mm Number of components: 127
Wire specifications: Lead length 300±8mm, RV standard wire, single end 5mm tinned.
Internal resistance: 1.5~1.7Ω (ambient temperature 23±1℃, 1kHZ AC test)
Large temperature difference: △Tmax(Qc=0) above 60℃.
Working current: Imax = 8A (when powered at rated voltage)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling Power: Qcmax 77W
Assembly pressure: 85N/cm2
Work environment: Temperature range of -55℃ to 83℃ (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: Standard 704 silicone rubber sealing around the perimeter
Packaging standards: Foam box packaging, storage conditions: ambient temperature -10℃ to 40℃
Storage conditions: -4°C to 60°C

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Chip model: TEC1-1.2710
Physical dimensions: 40*40*3.4 mm   Number of components: 127
Wire specifications: Lead length 300±5mm, RV standard wire, single end 5mm tinned.
Internal resistance: 1.2~1.5Ω (ambient temperature 23±1℃, 1kHZ AC test)
Large temperature difference: △Tmax(Qc=0) above 60℃.
Working current: Imax = 10A (when operating at a maximum voltage of 15V)
Rated voltage: DC12V (Vmax: 15.5V)
Cooling Power: Qcmax 92W
Assembly pressure: 85N/cm2
Work environment: Temperature range -55℃ to 83℃ (excessive ambient temperature will directly affect cooling efficiency)
Encapsulation process: Standard 704 silicone rubber sealing around the perimeter
Packaging standards: foam box packaging, storage conditions: ambient temperature -10℃ to 40℃
Storage conditions: -4°C to 60°C
 

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High voltage: 15.7V

High current: 12.0A

Large cooling capacity: 107W

Large temperature difference of 68 degrees