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| 2021 + | CN¥ 0.0 |













Company agent distribution products:
Memory Storage Chip Series: Packaging TSOP, BGA, SOP
SDRAM
DDR2
DDR3
DDR4
LPDDR3
LPDDR4
EMMC
EMicrocontroller Program" 或 "Microcomputer Program
NAND FLASH
NOR FLASH
CPU main chip series: BGA packaging, QFN
ALLWINNER全志
X-POWERS Core Intelligence Alliance
ROCKCHIP瑞芯微
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