Product Names: Copper Foil Conductive Tape, Pure Copper Foil Shielding Tape, Conductive Grounding Tape, Electronic Thermal Conductive Tape, EMI Electromagnetic Shielding Tape, Anti-static Conductive Adhesive Tape Substrate: A 99.98% high-purity copper foil substrate with flexible and strong tensile properties. It can be bent and fitted arbitrarily, has stable electrical conductivity, and is resistant to oxidation and corrosion. Adhesive type: High-end voltage-sensitive conductive adhesive, available in single-conductive and dual-conductive versions. The adhesive layer is uniform and fine; the resin contains conductive particles, ensuring smooth electrical continuity and strong adhesion. Adhesiveness: Strong initial adhesion and long-lasting hold; fits smoothly onto circuit boards, metals, plastics, glass, and other surfaces without curling or peeling off, and does not cause pathways. Core features: high conductivity with low resistance, electromagnetic shielding, anti-static grounding, thermal conduction and heat dissipation, high temperature resistance and oxidation resistance, flexible and easy to apply, solderable, and resistant to aging Specs: a wide range of widths, lengths, and thicknesses are available in stock; single or double guides for standard models are sufficient. Support for precision slitting, special-shaped die cutting, and custom production of large industrial rolls is also available. Temperature resistance range: -20℃ to 120℃, operates stably under normal high-temperature conditions without oxidation, debonding, or loss of electrical conductivity. Applicable processes: EMI shielding for electronic devices, ground conduction for circuit boards, heat dissipation and thermal conductivity for motherboards, anti-static wiring, signal interference resistance, and reinforcement of precision electronic repairs 2. Core Advantages of the Product 1. High-purity copper foil substrate with ultra-low resistance and excellent conductivity: Utilizing high-purity oxygen-free copper foil, the conductive particles are evenly distributed, ensuring full conductivity along both the X and Z axes. The contact resistance is extremely low, and the conductivity performance is stable and superior. It can quickly conduct circuits and establish grounding paths, eliminating issues such as poor contact and power failure, and meets the requirements for precision electronic conductivity. 2. Strong electromagnetic shielding and anti-interference: It features excellent EMI/RFI shielding properties, which can effectively block radio frequency interference. This helps resolve issues such as signal chaos, noise, screen flickering, and signal attenuation in electronic devices, thereby improving operational stability and safety. 3. Thermal conduction, heat dissipation, and anti-oxidation to reduce device temperature and enhance durability: The copper foil possesses excellent thermal conductivity and heat dissipation properties, enabling rapid removal of heat from the motherboard, chips, and circuits, thereby alleviating issues such as high-temperature lag and overheating crashes; it also features an anti-oxidation treatment, ensuring no blackening, oxidation, or corrosion over long-term use, with its electrical and thermal performance remaining stable without degradation. 4. Flexible and solderable, suitable for precise operating conditions: The substrate is lightweight, thin, and soft with excellent ductility. It can fit curved surfaces, edges, and tiny gaps without bulging; supports solder bonding for secure fixation, ensuring strong adhesion and low risk of detachment. Easy to cut by hand without specialized tools, ideal for electronic repair and industrial precision assembly applications.
III. General Application Scope
Electronics shielding field: circuit boards, motherboards, electromagnetic shielding for chips, anti-interference for precision instruments, signal protection for radio frequency devices, noise reduction and shielding for digital products. Grounding and anti-static fields: grounding of electronic devices, anti-static measures for production lines, circuit continuity, anti-static protection for household appliances, and static discharge for precision instruments. Thermal dissipation and heat conduction sector: heat dissipation for mobile phone motherboards, heat conduction for electronic chips, cooling of power devices, and thermal assistance for high-frequency operating equipment.
Maintenance in the industrial sector: repair and wiring replacement for electronic circuits, reinforcement of equipment conductivity, grounding protection for molds, anti-interference measures for communication equipment, and mass electronic assembly bonding.
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