Product Names: Conductive cloth tape, electromagnetic shielding conductive fabric, flexible grounding conductive tape, three-directional conductive cloth tape, anti-interference adhesive tape for electronics, anti-static tape for precision equipment Substrate: A composite layer of copper and nickel plating on the surface of a polyester fiber substrate, featuring a dense fabric structure that is lightweight, thin, soft, resistant to bending, friction, oxidation, corrosion, and does not easily peel off. Adhesive type: Industrial conductive acrylic pressure-sensitive adhesive. Available in single-sided and double-sided versions. The adhesive layer is uniform and fine, with embedded conductive particles, ensuring stable conductivity in all three directions (XYZ). Adhesiveness: The initial application is quick, with stable and long-lasting adhesion. It is suitable for circuit boards, metal casings, plastics, FPC flexible boards, and other substrates. It resists repeated bending without warping, does not peel, and maintains continuity. Core features: three-dimensional conductivity, low resistance and high efficiency, flexible and resistant to bending, strong shielding properties, wear and oxidation resistance, lightweight and smooth texture, halogen-free, precise adhesion Specs: a wide range of widths, lengths, and thicknesses are available in stock; plain weave/grid weave patterns, single-side/double-side designs are abundant; supports precision cutting, special-shaped cutting, and custom production of large industrial rolls. Temperature resistance range: -20℃ to 105℃. Performance remains stable under prolonged high-temperature conditions; no oxidation, no loss of viscosity, and the electrical shielding effect does not degrade. Applicable processes: precision electronic EMI shielding, anti-static grounding of equipment casings, FPC flexible board bonding, interference-resistant coating for circuits, digital product repair, high-frequency equipment shielding protection 2. Core Advantages of the Product 1. Three-dimensional full-area conductivity with stable low-resistance performance: Utilizing a copper-nickel composite coating process, the fabric surface has uniform conductivity, enabling three-dimensional conductivity in X, Y, and Z directions. The contact resistance is extremely low, and the conductive path remains uninterrupted. Compared to ordinary metal foil tape, it offers more stable conductivity and better contact fit, meeting the high-precision electronic low-resistance conductivity requirements. 2. Flexible and resistant to bending, suitable for irregular curved surfaces: The fabric substrate is lightweight, thin, and flexible, allowing it to be bent, curled, and fitted into tight spaces and curved surfaces. It does not break, delaminate, or fail after repeated bending, making it ideal for flexible circuit boards, irregular casings, and precise fitting at edges and corners. This addresses the problem of hard, brittle tape using copper or aluminum foil. 3. High-efficiency electromagnetic shielding with strong anti-interference capability: Features a high-quality copper-nickel coating shielding structure that covers a wide range of frequency bands. It effectively blocks radio frequency interference, eliminating issues such as signal noise, current hum, screen flicker, and signal drift in electronic devices. This significantly improves the operational stability of precision equipment, meeting industrial EMI protection standards.
4. Wear-resistant, anti-oxidation, durable and easy to process: The surface nickel layer provides protective treatment, offering excellent anti-oxidation, corrosion resistance, and friction resistance. It does not turn black or fail easily with long-term use; the fabric is cut without edges and does not shed fibers, allowing precise die-cutting processes. It is suitable for automated mass assembly, with strong adhesion and compatibility with various precision electronic assembly scenarios.
III. General Application Scope Precision electronics sector: electromagnetic shielding for phones, tablets, and digital devices; FPC flexible circuit board bonding; mainboard grounding and conductivity; anti-static protection for precision components. In the field of industrial control equipment: instruments and devices, industrial control motherboards, power adapters with anti-interference and shielding, grounding of device casings to release static electricity, and radiation protection for high-frequency devices.
Communication signal sector: communication equipment, RF equipment signal isolation and shielding, line noise filtering, anti-interference coating protection around antennas.
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